Signal Integrity has pins and design models available for board to board interconnects that can operate with a compliance of 0.25 mm and with a minimum total height from 1.1 mm to 2.0 mm.
These can be designed with a combination of high power and high frequency performance and are most often used for wafer probe card to ATE DUT board interfaces and for board to board module connections on ATE hardware or ATE DUT boards.
We design and manufacture high density, fine pitch board connectors down to 0.3 mm pitch. We can extend these connectors to create pitch translation interposers to ease board layout on 0.2 mm and 0.3 mm pitch device sockets.
Contact us for information on our interposer and pitch translation capabilities and how we can help you deliver your test and characterization interface solution.
0.2 mm pitch Board to Die Test Interface