IC Test Socket Heat Sinks
Signal Integrity has the engineering capability to integrate heat sinks into our Hand Test Lids. We design these using thermal modeling software and a large library of proven designs and profiles. Integrating heat sink hardware adds capability to test large arrays or high-power analog devices in hand test environments.
In addition, Signal Integrity engineering has the tools and experience to design board level and system level heat sinks for high power components and model thermal flow issues.